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Our Laser Coding and Marking systems help deliver actual savings to the production process while eliminating hazardous fumes produced by lasers during manufacturing.


Description: Laser warning symbolCO2, YAG and Diode lasers are commonly used to code and mark components or products which are manufactured from a variety of materials. Hazardous fumes and dust are produced when the substrate, lacquer, paint or coating is marked or cut. Purex systems not only help ensure compliance with International Health and Safety Law but also deliver actual cost savings to the production process.

Materials lased include:

  • Plastics (PVC & PET etc.)
  • Ceramics
  • Metals
  • Paper & Cardboard
  • Foil
  • Enamel
  • Wood
  • Glass
  • Rubber

The Solution

Description: laser marking tablet blister packsOur fume extraction systems are designed in conjunction with some of the world's largest laser coding & marking system manufactures to:

  • Prevent damage to the laser and components
  • Protect personnel from harmful fumes
  • Reduce product rejects due to poor laser performance
  • Maintain a constant extraction rate
  • Deliver long filter life
  • Interface with the laser



Machine Selection Guide

               
Codes Per Minute (CPM)
200i

400i

800i
High Dust

800i
High Gas

1500i

2000i

5000i
Good Enclosure Poor Enclosure
<200   - - - - -
  <200 X - - - -
200-500   X - - - -
  200-500 X X - - -
>500   X X - - -
  >500 X X X X -
Machines for lasing PVC X O X X X X X

Key:
Normal selection.
Select if extra filter capacity is required and/or additional airflow is required to extract from multiple lasers or heavy duty applications.
(-) May also be considered.
X  Unit not usually specified for application.
O For lasing onto PVC.

Notes:
1. The selection is based on the use of standard connection kit.
2. The 800i 3 tier unit is designed for use where the application has low dust, but high gas emissions. The 2 tier is designed for applications producing high dust emissions.
3.  A poor enclosure is where less than 4 sides of the process are enclosed.